The object of research is a plane strain predictive estimation method. Method. Assessment of flat deformation was carried out on the example of flat deformation of printing blanks due to thermal and chemical influences, which the blanks are repeatedly exposed in the process of receiving boards. The study was conducted on twenty -five manufactured blanks for printed circuit boards. Results. The dependence of the deformation on the parameters of the printed circuit board is non-linear. It is determined that in order to identify the dependencies of deformation on the position of the reference points, the most effective is the algorithm for processing the primary data arrays according to the criteria Precision, Recall, F1. The proposed method makes it possible to increase the prediction of deformation of the multilayer structure of the board.